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Arctic Silver 5 Thermal Compound, AS5-3.5G High-Density, 2.5-inch Width - CPU Fans, Computer Cooling
TWD 1165
Price Details
Excluding Shipping & Custom charges ( Shipping and custom charges will be calculated on checkout )
*All items will import from 美國
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Contains 99.9% pure silver, optimized for high-power CPUs, maximizes thermal transfer, and provides long-term stability.
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What Stands Out
產品詳情
- Contains 99.9% pure silver for maximized thermal transfer
- High-Density composition with over 88% thermally conductive filler by weight
- Utilizes controlled triple-phase viscosity using advanced polysynthetic oils
- Ensures long-term stability and does not separate, run, migrate, or bleed
- Thermal conductance of >350,000W/m2 °C (0.001 inch layer)
- Warning: Contains chemicals known to the State of California to cause cancer and birth defects
Who Should Buy?
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PC Builders
Ideal for DIY enthusiasts building custom PCs, providing superior heat transfer for better performance and longevity.
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Overclockers
Perfect for users pushing hardware limits, as it effectively manages high temperatures resulting from enhanced CPU performance.
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Gaming Enthusiasts
Great for gamers needing reliable cooling solutions during intensive gaming sessions to maintain optimal system temperatures.
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Casual Users
Not suitable for everyday users who do not push their systems, as standard compounds would suffice for basic needs.
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Budget Builders
May be too expensive for those on a tight budget who can find adequate thermal solutions at lower costs.
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Non-Computer Devices
Inappropriate for non-PC applications, as this thermal compound is specifically designed for CPU and GPU cooling.
產品描述
Arctic Silver 5 Thermal Compound, AS5-3.5G High-Density, 2.5-inch Width - CPU Fans, Computer Cooling
客戶問答
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問題:
What is the main component used for thermal transfer in Arctic Silver 5?
Answer: 99.9% pure silver particles. -
問題:
What is the thermal conductance of Arctic Silver 5?
Answer: >350,000W/m2 °C. -
問題:
Does Arctic Silver 5 provide long-term stability?
Answer: Yes, it will not separate, run, migrate, or bleed.
Arctic Silver Fans, Heatsinks & Cooling Editorial Review
The Heat Sink bonding agent offered by this product is receiving rave reviews from customers. It is being praised for its easy application and ability to significantly lower the temperature of the CPU and heat sink. One customer reported a temperature drop of 8 degrees Celsius, which speaks volumes about the effectiveness of this product. Customers also appreciate the speedy delivery, with one customer receiving their order in just 5 days from Ontario to Vancouver Island. The product comes in a 3.5ml syringe and is described as being of genuine quality. The product is not without its minor issues, however. One customer mentioned having difficulty opening the lid, although this seems to be a user error. Overall, customers are highly satisfied with this heat sink bonding agent, with one customer even claiming that it helped cool their PS4 significantly, reducing the noise from the Console.
Customer Reviews & Ratings
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5 星
100%
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4 星
0%
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3 星
0%
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2 星
0%
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1 星
0%
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優點
- Easy application
- Significant temperature drop
- Speedy delivery
- Genuine quality
缺點
- Difficulty opening the lid (user error)
Platform Trust & Buyer Confidence
“The product received very good packaging & safe…Thank You”
“Accurate delivery timing given”
“Not madly expensive like I thought, and much quicker than promised.”
“Never dealt with Ubuy before, but everything worked out great. Seamless cross border purchasing and shipping. Thanks!”
“The process was smooth, with clear communication and timelines. This was my 1st purchase and I am really impressed. I will definitely be coming back.”
Product Price History
重要資訊
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TWD 1165
立即訂購並活動它 週六, 七月 25
This item is not restrict in my country.(Please click on above link if this item is not restrict in your country, So our team will review and allow.)
QTY:
PCI DSS compliant and ISO 27001:2022 certified, with encrypted payments and full buyer protection on every order.
特色和優勢
- 99.9% pure silver particles for maximized thermal transfer
- Optimized for high-power CPUs
- Contains over 88% thermally conductive filler
- Controlled triple-phase viscosity for easy application and long-term stability
- Will not separate, run, migrate, or bleed
- Thermal conductance of >350,000W/m2 °C
Ubuy Assurance
Experience worry-free shopping with 100% original products, PCI DSS-compliant payment security, ISO 27001-certified data protection, the fastest cross-border delivery, free returns *, and secure packaging on every order.